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AMD may be playing chiplet Jenga with its next-gen server chips

AMD may be playing chiplet Jenga with its next-gen server chips

Here’s a glimpse of the future: AMD is said to be working on a datacentre CPU that uses stacked dies, actual compute chiplets, one on top of the other, for potentially huge core density or inter-core bandwidth.

Two prominent AMD leakers (@patrickschur_ and @execufix) have posted word of the new chip, known as Milan-X. For reference, Milan is the codename for AMD’s latest Epyc server chips, based on the Zen 3 architecture.

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